1. 2. 3. material content data sheet sales product name btf3050te issued 27. march 2015 ma# MA001263764 package pg-to252-5-11 weight* 355.09 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 1.424 0.40 0.40 4011 4011 leadframe non noble metal iron 7439-89-6 0.205 0.06 576 inorganic material phosphorus 7723-14-0 0.061 0.02 173 non noble metal copper 7440-50-8 204.243 57.51 57.59 575195 575944 wire non noble metal aluminium 7429-90-5 1.228 0.35 0.35 3458 3458 encapsulation organic material carbon black 1333-86-4 1.413 0.40 3978 plastics epoxy resin - 24.720 6.96 69618 inorganic material silicondioxide 60676-86-0 115.126 32.42 39.78 324219 397815 leadfinish non noble metal tin 7440-31-5 5.072 1.43 1.43 14285 14285 plating non noble metal nickel 7440-02-0 0.076 0.02 215 inorganic material phosphorus 7723-14-0 0.000 0.00 0.02 1 216 solder noble metal silver 7440-22-4 0.038 0.01 107 non noble metal tin 7440-31-5 0.030 0.01 85 non noble metal lead 7439-92-1 1.448 0.41 0.43 4079 4271 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and contains pb according rohs exemption 7a, lead in high melting temperature type solders. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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